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Creators/Authors contains: "Han, Meikang"

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  1. Abstract High electrical conductivity is desired in MXene films for applications such as electromagnetic interference shielding, antennas, and electrodes for electrochemical energy storage and conversion applications. Due to the acid etching-based synthesis method, it is challenging to deconvolute the relative importance that factors such as chemical composition and flake size contribute to resistivity. To understand the intrinsic and extrinsic contributions to the macroscopic electronic transport properties, a systematic study controlling compositional and structural parameters was conducted with eight solid solutions in the Ti y Nb 2− y CT x system. In particular, we investigated the different roles played by metal (M)-site composition, flake size, and d -spacing on macroscopic transport. Hard x-ray photoemission spectroscopy and spectroscopic ellipsometry revealed changes to electronic structure induced by the M-site alloying. Consistent with the spectroscopic results, the low- and room-temperature conductivities and effective carrier mobility are correlated with the Ti content, while the impact of flake size and d -spacing is most prominent in low-temperature transport. The results provide guidance for designing and engineering MXenes with a wide range of conductivities. 
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  2. Abstract MXenes are an emergent class of two-dimensional materials with a very wide spectrum of promising applications. The synthesis of multiple MXenes, specifically solid-solution MXenes, allows fine tuning of their properties, expands their range of applications, and leads to enhanced performance. The functionality of solid-solution MXenes is closely related to the valence state of their constituents: transition metals, oxygen, carbon, and nitrogen. However, the impact of changes in the oxidation state of elements in MXenes is not well understood. In this work, three interrelated solid-solution MXene systems (Ti 2− y Nb y CT x , Nb 2− y V y CT x , and Ti 2− y V y CT x ) were investigated with scanning transmission electron microscopy and electron energy-loss spectroscopy to determine the localized valence states of metals at the nanoscale. The analysis demonstrates changes in the electronic configuration of V upon modification of the overall composition and within individual MXene flakes. These shifts of oxidation state can explain the nonlinear optical and electronic features of solid-solution MXenes. Vanadium appears to be particularly sensitive to modification of the valence state, while titanium maintains the same oxidation state in Ti–Nb and Ti–V MXenes, regardless of stoichiometry. The study also explains Nb’s influential role in the previously observed electronic properties in the Nb–V and Nb–Ti systems. 
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  4. Abstract Highly integrated, flexible, and ultrathin wireless communication components are in significant demand due to the explosive growth of portable and wearable electronic devices in the fifth‐generation (5G) network era, but only conventional metals meet the requirements for emerging radio‐frequency (RF) devices so far. Here, it is reported on Ti3C2TxMXene microstrip transmission lines with low‐energy attenuation and patch antennas with high‐power radiation at frequencies from 5.6 to 16.4 GHz. The radiation efficiency of a 5.5 µm thick MXene patch antenna manufactured by spray‐coating from aqueous solution reaches 99% at 16.4 GHz, which is about the same as that of a standard 35 µm thick copper patch antenna at about 15% of its thickness and 7% of the copper weight. MXene outperforms all other materials evaluated for patch antennas to date. Moreover, it is demonstrated that an MXene patch antenna array with integrated feeding circuits on a conformal surface has comparable performance with that of a copper antenna array at 28 GHz, which is a target frequency in practical 5G applications. The versatility of MXene antennas in wide frequency ranges coupled with the flexibility, scalability, and ease of solution processing makes MXene promising for integrated RF components in various flexible electronic devices. 
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